Mini-Circuits has been awarded a new patent for a novel integrated LTCC packaging technology that provides a low-cost solution for millimeter-wave surface-mount components operating to 60 GHz and beyond. U.S. patent number 10,861,803 B1 was issued December 8, naming Mini-Circuits LTCC product line manager, Aaron Vaisman as the inventor.
The limitations of surface-mount packaging have . . .