Sumitomo Electric Device Innovations, a leading provider of RF & Microwave devices, introduce their line of high-power GaN products for X-Band radar applications. Next generation X-Band radars face significant size, weight, power, and cost (SWAP-C) challenges. Among the challenges are the RF power amplifier designs used in these radar systems. Sumitomo Electric has developed a line of . . .
Comcast is working to enhance their position with streaming video by providing smart TV's customized for having the Comcast authorized content. They are working with Hisense, the TV manufacturer, to offer smart TV's that are compatible with the Comcast service. The smart TV’s might be available next year.
This should help Comcast’s position in providing content as well as . . .
AFR 2 µm high-power series addresses the growing demand at the 2 µm region. Its performance and reliability are guaranteed by AFR proprietary design and manufacturing process that suppress unwanted absorption in this wavelength range.
2 µm 50 W In-Line Isolator / 2 µm 100 W Fiber-To-Free-Space Isolator
The polarization insensitive . . .
Designed to provide superior network coverage in an extensive range of cross-market wireless applications, the new ultraminiature W Series Embedded Wi-Fi Antennas are available in several standard single- & dual-band designs with PCB or FPC antenna technologies, performance-enhancing foam coatings, & various mounting options.
AVX . . .
Mini-Circuits has been awarded a new patent for a novel integrated LTCC packaging technology that provides a low-cost solution for millimeter-wave surface-mount components operating to 60 GHz and beyond. U.S. patent number 10,861,803 B1 was issued December 8, naming Mini-Circuits LTCC product line manager, Aaron Vaisman as the inventor.
The limitations of surface-mount packaging have . . .
Amplitude Technical Sales, Agile Calibration and Alltest have teamed up to offer expanded equipment services
Agile Calibration is now your one stop calibration and repair company. We have teamed up with Alltest Instruments to offer off site (mail in) calibration AND service for all your test & measurement equipment needs. Likewise, Agile Calibration will handle onsite calibration for Alltest’s customer base – truly a . . .
November 8, 2018
Amplitude will be exhibiting at the Long Island Power Electronics Symposium on November 8, 2018. The Long Island Power Electronics Symposium & Exhibits is the area's premier annual event that brings together the local power electronics community. The event will take place on Thursday, November 8, and attendees may arrive anytime and leave anytime from noon to 8:00 PM. The venue is the . . .
Sumitomo Electric Industries, Ltd and its group company Sumitomo Electric Device Innovations USA, Inc. (SEDU) will participate in the 2018 International Microwave Symposium (IMS 2018) held in Philadelphia, USA. SEDU is a leading provider of advanced RF(radiofrequency), wireless and optical communications solutions. Its latest offerings include S-band and X-band GaN HEMTs . . .
We are pleased to announce that Agile Calibration has received its Certificate of Accreditation from Perry Johnson Laboratory Accreditation, Inc. (PJLA). PJLA who hereby declares Agile Calibration accredited in accordance with the recognized International Standard: ISO/IEC 17025:2005.
Rosenberger North America developed the series WSMP® connector based on the SMP series. They are designed in very small dimensions and very high frequencies up to 100 GHz.WSMP® connectors are about 45 % smaller than SMP connectors, and feature a high packing density, have a push-on . . .
Mini-Circuits is committed to meeting our customers' needs as the evolution of wireless standards continues to push application requirements to higher frequencies. The new BW-V series of precision fixed attenuators expands the coverage of our product line up to 50 GHz, supporting applications including . . .
Advanced Fiber Resources (AFR) debuted its latest addition to the AFR family of products, a Metalized Fiber Cable during a recent trade show. A metal film is deposited on the fiber surface using a sputtering process. Metalized fiber can be soldered into a package to achieve a hermetically sealed environment that also provides a highly reliable interconnection for optical devices. The fiber is . . .